UP Squared Pro TWL AI Dev Kit Series [Up to 214 TOPs]

As low as $809.00

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UPN-TWL-Series

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RPI MIPICSI Camera Converter Kit
$39.00

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5G Module (North America)
Special Price $239.00 Regular Price $339.00

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M.2 3042 LTE module kit (Global)
$69.99

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M.2 2230 Wi-Fi 6E Kit (Intel® Wi-Fi 6E AX210)
$34.90

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MIPICSI Camera Converter Kit
$49.00

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Check the webinar for more understanding about how this kit can help accelerate Your AI Project. LinK

The UP Squared Pro TWL Dev Kit takes AI performance up a notch with its Palm+ size dev board and integrated AI Accelerator options, providing up to 25 TOPS of AI inferencing power and in the future supports up to 214 TOPs according to Axelera Metis® AI acceleration card
- Intel® Processor N150 (formerly Twin Lake)
- 24 Execution Units (EU) available for AI workloads
- Multiple options of AI Module provide AI capability up to 214 TOPS
- Expandability for mipi via UP RPI MIPI camera converter Kit
- Ubuntu Pro 24.04 LTS preinstalled with UP AI SW Dev Suite

* For evaluation purpose, no guarantee from Canonical. License is a must other than evaluation unit. Please contact shop@up-board.org for more information.

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Specification

UPN-TWLN150-A12-0864-AIKT1

Product Details
Name	UPS Pro TWL AI Dev Kit [Hailo 8L: 13TOPS]
SKU	UPN-TWLN150-A12-0864-AIKT1

General
Processor	Intel® Processor N150
Mainboard	UPS Pro TWL
Graphics	Intel® UHD Graphics
VPU	Hailo-8L™ M.2 2230 AI Module w/ heatsink [13 TOPS]
Pre-Installed Module	via M.2 2230-Hailo 8L
Memory	8GB
eMMC / Storage	64 GB
FPGA	Lattice
BIOS	UEFI
RTC	Yes
Wake-on-LAN (WoL)	Yes
Watchdog Timer	Yes
PXE	Yes
TPM	TPM2.0 on board
Pre-Installed OS	Ubuntu 24.04 LTS
Compatible OS	Windows 11 LTSC Ubuntu 22.04/kernel 6.11+, ubuntu 24.04/kernel 6.11+, Yocto 5+
Dimension	101.6 mm × 101.6 mm

Display
HDMI	1 x HDMI 2.0b
Display Port	1 x DP 1.2 1 x DP 1.4a via USB Type C

I/O
USB	2 x USB 2.0 via 10-pin wafer 2 x USB 3.2 Gen 2 Type A 1 x USB 3.2 Type C
Audio	1x Audio Jack (Mic-in, Line out)
UART	1x UART via 10pin wafer
Serial Port	2 x RS-232/422/485 10-pin header
Expansion Slot	1 x M.2 2280 M key (PCIe Gen 3 x2, USB2.0) 1 x M.2 2230 E key (CNVI , PCIe Gen 3 x1, USB2.0) taken by Hailo-8L™ M.2 2230 AI Module 1 x M.2 3052 B Key (USB3.2 Gen 2 only) with Nano SIM slot
GPIO	Yes
MIPI-CSI	Yes

Connectivity
Ethernet	2 x 2.5GbE (Intel® i226IT)
Wi-Fi	optional ( via. M.2 2230 ) taken by Hailo-8L™ M.2 2230 Module
Bluetooth	optional ( via. M.2 2230 ) taken by Hailo-8L™ M.2 2230 Module
LTE / 4G / 5G	optional ( via. M.2 3052 )

Power
Power Requirement	12V DC-in
Power Supply Type	AT/ATX mode
Power Consumption (Typical)	26W~35W

Environmental & Certification
Cooling	Active heatsink
Operating Temperature	32°F ~ 140°F (0°C ~ 60°C)
Storage temperature	-40°F ~ 176°F (-40°C ~ 80°C)
Certification	CE/FCC Class A, RoHS Compliant, REACH

Package
Net Weight	750gm
Gross Weight	1200gm
HS Code	8473302000
Country of Origin	Taiwan

Accessories
Accessories	1x Hailo-8L™ M.2 2230 Module w/ heatsink 1x UP HD Camera 1x 12V/6A Power Adapter

UPN-TWLN150-A12-0864-AIKT2

Product Details
Name	UPS Pro TWL AI Dev Kit [Deep X: 25TOPS]
SKU	UPN-TWLN150-A12-0864-AIKT2

General
Processor	Intel® Processor N150
Mainboard	UPS Pro TWL
Graphics	Intel® UHD Graphics
VPU	DEEPX.DX-M1 M.2 2280 AI Module w/ heatsink [25 TOPS]
Pre-Installed Module	via M.2 2280-Deep X M1
Memory	8GB
eMMC / Storage	64 GB
FPGA	Lattice
BIOS	UEFI
RTC	Yes
Wake-on-LAN (WoL)	Yes
Watchdog Timer	Yes
PXE	Yes
TPM	TPM2.0 on board
Pre-Installed OS	Ubuntu 24.04 LTS
Compatible OS	Windows 11 LTSC Ubuntu 22.04/kernel 6.11+, ubuntu 24.04/kernel 6.11+, Yocto 5+
Dimension	101.6 mm × 101.6 mm

Display
HDMI	1 x HDMI 2.0b
Display Port	1 x DP 1.2 1 x DP 1.4a via USB Type C

I/O
USB	2 x USB 2.0 via 10-pin wafer 2 x USB 3.2 Gen 2 Type A 1 x USB 3.2 Type C
Audio	1x Audio Jack (Mic-in, Line out)
UART	1x UART via 10pin wafer
Serial Port	2 x RS-232/422/485 10-pin header
Expansion Slot	1 x M.2 2280 M key (PCIe Gen 3 x2, USB2.0) taken by DEEPX.DX-M1 M.2 2280 AI Module 1 x M.2 2230 E key (CNVI , PCIe Gen 3 x1, USB2.0) 1 x M.2 3052 B Key (USB3.2 Gen 2 only) with Nano SIM slot
GPIO	Yes
MIPI-CSI	Yes

Connectivity
Ethernet	2 x 2.5GbE (Intel® i226IT)
Wi-Fi	optional ( via. M.2 2230)
Bluetooth	optional ( via. M.2 2230)
LTE / 4G / 5G	optional ( via. M.2 3052)

Power
Power Requirement	12V DC-in
Power Supply Type	AT/ATX mode
Power Consumption (Typical)	26W~35W

Environmental & Certification
Cooling	Active heatsink
Operating Temperature	32°F ~ 140°F (0°C ~ 60°C)
Storage temperature	-40°F ~ 176°F (-40°C ~ 80°C)
Certification	CE/FCC Class A, RoHS Compliant, REACH

Package
Net Weight	750 gm
Gross Weight	1200 gm
HS Code	8473302000
Country of Origin	Taiwan

Accessories
Accessories	1x DEEPX.DX-M1 M.2 2280 Module w/ heatsink 1x UP HD Camera 1x 12V/6A Power Adapter

Downloads

	UP AI SW Dev Suite Tutorial	N/A	N/A	Download
	UPS Pro TWL AI Dev Kit Datasheet	N/A	N/A	Download