UP Xtreme i11 Edge 0000 i7-1185GRE

Schedule TBD
UP Xtreme i11 Edge is a powerful edge computing system, powered by the 11th Gen Intel® Core™ processors with Iris® Xe graphics (formerly Tiger Lake UP3).
Fast: NVMe, USB 3.2, 2.5Gigabit Ethernet
Expandable: M.2 2230 E key, M.2 2280 B+M key, M.2 3052 B Key, PCIe [x4] to allow for seamless integration.
Ready to connect: Ready to connect 5G, WiFi ( WiFi 5/WiFi 6), Bluetooth
Technology: vPro, In-Band ECC, Intel® Time Coordinated Computing (TCC) and time-sensitive networking (TSN)
Security: TPM v2.0
*SODIMM RAM(max. 64GB)needs to be purchased separately and installed.
*Storage options(SATA 3.0 Disk or NVMe Disk)needs to be purchased separately and installed.
Fan & Fanless SKU available
Power supply unit and power cord to purchase separately
When using AI Module, 96 W PSU is what you would need to experience full usage.
Product Details
Name UP Xtreme i11 Edge 0000 i7-1185GRE
Mainboard UP Xtreme i11
Processor Intel® 11th Gen Core™ (Core i7-1185GRE)
Graphics Intel® Iris® Xe Graphics
VPU optional (via M.2 2280)
Memory via 2x SO-DIMM DDR4*
eMMC / Storage via SATA or M.2 2280 NVMe*
Wake-on-LAN (WoL) Yes
Watchdog Timer Yes
TPM TPM 2.0 on board
Compatible OS Microsoft Windows 10 full version, Yocto project 3.1 Kernel 5.4 Ubuntu 20.04 Kernel 5.4
Dimension 152mm x 123.8mm x 66.5mm
HDMI 1 (HDMI 2.0)
Display Port 1 x DP 1.4+ 1x USB Type C ( 1x DP 1.4/ USB4.0)
USB USB 2.0 Type-A X1
USB 3.2 Gen 2 Type-A X3
USB 4.0 x1 (Type C)
Audio Mic-in/Line Out (3.5 mm audio jack)
Serial Port 2x RS232/422/485
Expansion Slot 1x M.2 2280 M key ( support NVME SSD), 1x M.2 2230 E key , 1x M.2 3052 B Key (USB3.0 interface) with Nano SIM socket , 1x PCI-e[x4] ( Need customized chassis)
Ethernet 1 x 1GbLAN (i219)*, 1x 2.5Gb LAN (i225), *vPRO is only available in i7/i5 CPU
Wi-Fi optional ( via. M.2 2230 )
Bluetooth optional ( via. M.2 2230 )
LTE / 4G / 5G optional ( via. M.2 3052 )
Power Requirement 12V DC-IN (lockable connector)
Power Supply Type AT (default) /ATX
Power Consumption (Typical) 60 Watt
Environmental & Certification
Cooling Active heatsink
Operating Temperature 32°F ~ 140°F (0°C ~ 60°C)
Storage temperature -40°F ~ 176°F (-40°C ~ 80°C)
Certification CE/FCC Class A,RoHS
Net Weight 2.3 kg
Gross Weight 4 kg
Package dimension (L x W x H) 278 x 269 x 149 mm
HS Code 8471500000
Country of Origin Taiwan
Longevity 2035
Accessories VESA Kit
SATA cable
Screw packs

TSN Support


TSN Features
802.1AS (Time Synchronization)
Project Based only
802.1Qav (CBS)
802.1Qbv (TAS)

NOTE: Please note that ADC is currently not working due to kernel regression (future kernel releases will fix the issue).

NOTE: Please note that the latest NVM for i225 IT Ethernet controller is not working in Ubuntu Linux. Please refer here for more info.


For more information, please refer to UP Xtreme i11 wiki page

1) The latest 11th Gen Intel® Core™ processor with Intel Iris Xe graphic (code name: Tiger Lake) powers the UP Xtreme i11 Edge Compute Enabling Kit and clocks up to 4.4 GHz with only 28 watts TDP and 15 watts cTDP.
2) Intel® Iris® Xe graphics provide up to 96EU, which is nearly twice the performance of corresponding Ice Lake Gen 11 at the same TDP.
Fast & Expandable
1) 5G supported for ultra-reliable low latency communications
2) Intel® Ethernet Controller i225 runs 2.5 Gbps Speed
3) Ready to connect: Ready to connect 5G, WiFi ( WiFi 5/WiFi 6), Bluetooth
Industrial and Security
1) Supports standard industry 12V power input with a lockable power connector
2) Reduce latency and minimize jitter with Intel® Time Coordinated Computing (TCC) and time-sensitive networking (TSN) technology
3) TPM 2.0 & In-Band ECC Supported
AI Ready
1) Optimize resource allocation for AI interference at the edge via Intel® Distribution of OpenVINO™ toolkit across CPU, GPU, and VPU
2) Optional VPU by adding UP AI Core XM2280, speed up your AI development by leveraging samples and various pre-trained models that come with the kit
Production Ready Computing System
1) UP Xtreme i11 Edge Compute Enabling Kit is production-ready for multiple vertical markets for robotics, automation, retail, AI and IoT. Worldwide shipping in 7 days.
2) The kit comes with Intel® Distribution of OpenVINO™ Toolkit pre-loaded to make your AI and computer vision application faster. It is also compatible with Intel® OneAPI, which is easy to install via command line.

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