Kit de desenvolvimento UPS Pro TWL AI [Deep X: 25TOPS]

Product Details

Name	Kit de desenvolvimento UPS Pro TWL AI [Deep X: 25TOPS]
SKU	UPN-TWLN150-A12-0864-AIKT2

General

Processor	Intel® Processor N150
Mainboard	UPS Pro TWL
Graphics	Intel® UHD Graphics
VPU	DEEPX.DX-M1 M.2 2280 Módulo AI com dissipador de calor [25 TOPS]
Pre-Installed Module	via M.2 2280-Deep X M1
Memory	8GB
eMMC / Storage	64 GB
FPGA	Lattice
BIOS	UEFI
RTC	Yes
Wake-on-LAN (WoL)	Yes
Watchdog Timer	Yes
PXE	Yes
TPM	TPM2.0 a bordo
Pre-Installed OS	Ubuntu 24.04 LTS
Compatible OS	Windows 11 LTSC Ubuntu 22.04/kernel 6.11+, ubuntu 24.04/kernel 6.11+, Yocto 5+
Dimension	101,6 mm × 101,6 mm

Display

HDMI	1 x HDMI 2.0b
Display Port	1 x DP 1.2 1 x DP 1.4a via USB Type C

I/O

USB	2 x USB 2.0 via wafer de 10 pinos 2 x USB 3.2 Gen 2 Tipo A 1 x USB 3.2 Tipo C
Audio	1x Conector de áudio (entrada de microfone, saída de linha)
UART	1x UART via wafer de 10 pinos
Serial Port	2 x conectores RS-232/422/485 de 10 pinos
Expansion Slot	1 x chave M.2 2280 M (PCIe Gen 3 x2, USB 2.0) obtida pelo módulo DEEPX.DX-M1 M.2 2280 AI 1 x chave M.2 2230 E (CNVI, PCIe Gen 3 x1, USB 2.0) 1 x M.2 3052 B Key (somente USB3.2 Gen 2) com slot Nano SIM
GPIO	Yes
MIPI-CSI	Sim

Connectivity

Ethernet	2 x 2.5GbE (Intel® i226IT)
Wi-Fi	opcional (via M.2 2230)
Bluetooth	opcional (via M.2 2230)
LTE / 4G / 5G	opcional (via M.2 3052)

Power

Power Requirement	Entrada DC 12V
Power Supply Type	Modo AT/ATX
Power Consumption (Typical)	26W~35W

Environmental & Certification

Cooling	Active heatsink
Operating Temperature	32°F ~ 140°F (0°C ~ 60°C)
Storage temperature	-40°F ~ 176°F (-40°C ~ 80°C)
Certification	CE/FCC Class A, RoHS Compliant, REACH

Package

Net Weight	750 gramas
Gross Weight	1200 gramas
HS Code	8473302000
Country of Origin	Taiwan

Accessories

Accessories	1x Módulo DEEPX.DX-M1 M.2 2280 com dissipador de calor 1x Câmera UP HD 1x adaptador de energia 12V/6A