-
DDR4-3200mhz SODIMM 260-Pin 16GB Samsung
$88.00 -
New M.2 2230 WiFi kit for UP Squared/UP Xtreme/UP Squared Pro/UPX i11 (RE-WFKIT-9260NVP)
$29.99 -
M.2 SSD 2280 256GB,PCIe Gen3 x 4, M Key,3D TLC, Kingston
$58.00 -
Power Supply 12V@6A - w/o Power cord (EP-PS12V6A72WFJ)
$15.99 -
DDR4-3200 SODIMM 260-Pin 8GB Samsung
$46.00 -
UP AI Core XP4 (Myriad X *4)
$389.00
UP Xtreme i11 0001 i5-1145GRE
UP Xtreme i11 board with Core i5-1145GRE w/o 40pin, Type C, 0001 version
See datasheet for more specifications datasheet
Create an account
Datasheet
| SKU | UPX-TGLI5-A10-0000-0001 |
|---|
| Part number | UPX-TGLI5-A10-0000-0001 |
|---|---|
| Availability/Type | Active |
| SoC | Intel® Core™ i5-1145GRE ( up to 4.1 GHz) |
|---|---|
| # of Core | 4 |
| Graphics | Intel® Iris® Xe Graphics |
| VPU | optional (via M.2 2280) |
| MCU | N/A |
| memory | via 2x SO-DIMM DDR4* |
| eMMC/Storage | via SATA or M.2 2280 NVMe* |
| BIOS | UEFI |
| RTC | Yes |
| WAKE ON LAN (WoL) | Yes |
| Watchdog timer | Yes |
| PXE | Yes |
| Compatible OS | Microsoft Windows 10 full version, Yocto project 3.1 Kernel 5.4 Ubuntu 20.04 Kernel 5.4 |
| Pre-installed OS | Optional Windows 10 |
| Power requirement | 12V DC-IN (lockable connector) |
| Power Supply Type | AT (default) /ATX |
| Power Consumption ( typical) | 60 Watt |
| Dimension | 120 mm x 120mm |
| Operating temperature | 32°F ~ 140°F (0°C ~ 60°C) |
| Storage temperature | -40°F ~ 176°F (-40°C ~ 80°C) |
| Operating Humidity | 0% ~ 90% relative humidity, non-condensing |
| MTBF ( hours) | T.B.A. |
| Certification | CE/FCC Class A,RoHS |
| HDMI | 1 (HDMI 2.0) |
|---|---|
| Display Port | 1 (DP 1.4） |
| MIPI DSI/ eDP | 1 x eDP (4K@60hz) |
| Audio | Line in/Out (3.5 mm audio jack) |
|---|---|
| USB 2.0 Type-A | 1 |
| USB 3.2 Gen 2 Type-A | 3 |
| UART | N/A |
| Serial port | 2x RS232/422/485 |
| HDD interface | 1 x SATA 3.0 |
| Expansion Slot | 1x M.2 2280 M key ( support NVME SSD) ,1x M.2 2230 E key ,1x M.2 3052 B Key (USB3.0 interface) with Micro SIM, 1x PCI-e[x4] ( adapter board accessory required) |
| AIO/DIO | N/A |
| 40-pin GP-Bus | N/A |
| 100-pin GP Bus | N/A |
| MIPI-CSI | N/A |
| SIM slot | Yes |
| Others | TPM 2.0 on board |
| Ethernet | 1 x 1GbLAN (i219)*, 1x 2.5Gb LAN (i225), *vPRO is only available in i7/i5 CPU |
|---|---|
| WiFi | optional ( via. M.2 2230 ) |
| Bluetooth | optional ( via. M.2 2230 ) |
| LTE/4G/5G | optional ( via. M.2 3052 ) |
| Cooling | active cooling |
|---|
| Longevity | 2035 |
|---|
| Accessories | 1x RTC battery 1x active heatsink |
|---|
| Others | 4 LEDs YRGB (under ethernet port), 1x power button, 1x reset button |
|---|
| Net weight | 295.2 gram |
|---|---|
| Package dimension (L x W x H) | 229*181*97mm |
| Gross weight | 524.1gms |
| HS Code | 8471500000 |
| Country of Origin | Taiwan |
More Info
TSN Support
|
TSN Features |
Support |
|
802.1AS (Time Synchronization) |
Project Based only |
|
802.1Qav (CBS) |
Y |
|
802.1Qbv (TAS) |
Y |
NOTE: Please note that ADC is currently not working due to kernel regression (future kernel releases will fix the issue).
NOTE: Please note that the latest NVM for i225 IT Ethernet controller is not working in Ubuntu Linux. Please refer here for more info.
For more information, please refer to UP Xtreme i11 wiki page
Powerful
1) The latest 11th Gen Intel® Core™ processor with Intel Iris Xe graphic (code name: Tiger Lake) powers the UP Xtreme i11 Edge Compute Enabling Kit and clocks up to 4.4 GHz with only 28 watts TDP and 15 watts cTDP.
2) Intel® Iris® Xe graphics provide up to 96EU, which is nearly twice the performance of corresponding Ice Lake Gen 11 at the same TDP.
Fast & Expandable
1) 5G supported for ultra-reliable low latency communications
2) Intel® Ethernet Controller i225 runs 2.5 Gbps Speed
3) Ready to connect: Ready to connect 5G, WiFi ( WiFi 5/WiFi 6), Bluetooth
Industrial and Security
1) Supports standard industry 12V power input with a lockable power connector
2) Reduce latency and minimize jitter with Intel® Time Coordinated Computing (TCC) and time-sensitive networking (TSN) technology
3) TPM 2.0 & In-Band ECC Supported
4) Supports Functional Safety (FuSA): First Intel® Core™ product combining Integrity Features and Intel® Functional Safety Essential Design Package (Intel® FSEDP)
AI Ready
1) Optimize resource allocation for AI interference at the edge via Intel® Distribution of OpenVINO™ toolkit across CPU, GPU, and VPU
2) Optional VPU by adding UP AI Core XM2280/KB2280, speed up your AI development by leveraging samples and various pre-trained models that come with the kit
3) Supports Intel’s third-gen VPU (code-name: Keem Bay) that will offer 10 times the AI Performance than its Intel® Movidius™ Myriad X chip, but with up to 4.7 times more power efficiency
Production Ready Computing System
1) UP Xtreme i11 Edge Compute Enabling Kit is production-ready for multiple vertical markets for robotics, automation, retail, AI and IoT. Worldwide shipping in 7 days.
2) The kit comes with Intel® Distribution of OpenVINO™ Toolkit pre-loaded to make your AI and computer vision application faster. It is also compatible with Intel® OneAPI, which is easy to install via command line.
List of Contents
