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UP Xtreme i11 i3



UP Xtreme i11 has a M.2 3052 slot to support 5G modules to enable ultra-low latency and reliable transmission of data to/from masses of IoT devices, which ensures the convergence of 5G, AI, Cloud Computing, Data Analytics, and IIOT.

Combined with Intel AI Accelerator and Intel® Distribution of OpenVINO™ toolkit, it accelerates Computer Vision (CV) and Deep Learning Inference from Edge to Cloud. It also offers pre-trained models, and pre-optimized kernels to increase performance for AI.

Powerful: The latest 11th Gen Intel® Core™ processor with Intel Iris Xe graphic
Fast: NVMe, USB 3.2, USB 4.0 Type C
Expandable: 40-pin I/O expansion, M.2 2230 E key, M.2 2280 B+M key, M.2 3052 B Key, PCIe [x4] to allow for seamless integration.
Ready to connect: Ready to connect 5G, WiFi ( WiFi 5/WiFi 6), Bluetooth

*SODIMM RAM(max. 64GB)needs to be purchased separately and installed.
*Storage options(SATA 3.0 Disk or NVMe Disk)needs to be purchased separately and installed.

See datasheet for more specifications datasheet

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Special Price $499.00 Regular Price $519.00
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Datasheet

General
SKU UPX-TGLI3-A10-0000
Basic info
Part number UPX-TGLI3-A10-0000
Availability/Type Active
system level
SoC Intel® Core™ i3-1115GRE ( up to 3.9 GHz)
# of Core 2
Graphics Intel® UHD Graphics for 11th Gen Intel® Processors
VPU optional (via M.2 2280)
FPGA Intel® FPGA Altera Max V
MCU N/A
memory via 2x SO-DIMM DDR4*
eMMC/Storage via SATA or M.2 2280 NVMe*
BIOS UEFI
RTC Yes
WAKE ON LAN (WoL) Yes
Watchdog timer Yes
PXE Yes
Compatible OS Microsoft Windows 10 full version, Yocto project 3.1 Kernel 5.4 Ubuntu 20.04 Kernel 5.4
Pre-installed OS Optional Windows 10
Power requirement 12V DC-IN (lockable connector)
Power Supply Type AT (default) /ATX
Power Consumption ( typical) 60 Watt
Dimension 120 mm x 122mm
Operation temperature 32°F ~ 140°F (0°C ~ 60°C)
Storage temperature -40°F ~ 176°F (-40°C ~ 80°C)
Operation Humidity 0% ~ 90% relative humidity, non-condensing
MTBF ( hours) T.B.A.
Certification CE/FCC Class A,RoHS
Display
HDMI 1 (HDMI 2.0)
Display Port 1x DP 1.4+ 1x USB Type C ( 1x DP 1.4/ USB4.0)
MIPI DSI/ eDP 1 x eDP (4K@60hz)
I/O
Audio Line in/Out (3.5 mm audio jack)
USB 2.0 type A 1
USB 3.2 (Type A) 3
USB 4.0 Type C 1
UART 1 x HSUART (pin header)
Serial port 2x RS232/422/485
HDD interface 1 x SATA 3.0
Expansion Slot 1x M.2 2280 M key ( support NVME SSD) ,1x M.2 2230 E key ,1x M.2 3052 B Key (USB3.0 interface) with Micro SIM, 1x PCI-e[x4] ( adapter board accessory required)
AIO/DIO via GP-bus
40-pin GP-Bus 1
100-pin GP Bus N/A
MIPI-CSI N/A
SIM slot Yes
Others TPM 2.0 on board
Connectivity
Ethernet 1 x 1GbLAN (i219)*, 1x 2.5Gb LAN (i225), *vPRO is only available in i7/i5 CPU
WiFi optional ( via. M.2 2230 )
Bluetooth optional ( via. M.2 2230 )
LTE/4G/5G optional ( via. M.2 3052 )
Cooling
Cooling active cooling
Longevity
Longevity 2035
Accessories
Accessories 1x RTC battery 1x active heatsink
Others
Others 4 LEDs YRGB (under ethernet port), 1x power button, 1x reset button
Package
Net weight 295.2 gram
Package dimension (L x W x H) 229*181*97mm
Gross weight 524.1gms
HS Code 8473302000
Country of Origin Taiwan

More Info

TSN Support

TSN Features

Support

802.1AS (Time Synchronization)

Project Based only

802.1Qav (CBS)

Y

802.1Qbv (TAS)

Y

 

NOTE: Please note that ADC is currently not working due to kernel regression (future kernel releases will fix the issue).

NOTE: Please note that the latest NVM for i225 IT Ethernet controller is not working in Ubuntu Linux. Please refer here for more info.

 

For more information, please refer to UP Xtreme i11 wiki page

Powerful

1) The latest 11th Gen Intel® Core™ processor with Intel Iris Xe graphic (code name: Tiger Lake) powers the UP Xtreme i11 Edge Compute Enabling Kit and clocks up to 4.4 GHz with only 28 watts TDP and 15 watts cTDP.
2) Intel® Iris® Xe graphics provide up to 96EU, which is nearly twice the performance of corresponding Ice Lake Gen 11 at the same TDP.


Fast & Expandable

1) 5G supported for ultra-reliable low latency communications
2) Intel® Ethernet Controller i225 runs 2.5 Gbps Speed
3) Ready to connect: Ready to connect 5G, WiFi ( WiFi 5/WiFi 6), Bluetooth


Industrial and Security

1) Supports standard industry 12V power input with a lockable power connector
2) Reduce latency and minimize jitter with Intel® Time Coordinated Computing (TCC) and time-sensitive networking (TSN) technology
3) TPM 2.0 & In-Band ECC Supported
4) Supports Functional Safety (FuSA): First Intel® Core™ product combining Integrity Features and Intel® Functional Safety Essential Design Package (Intel® FSEDP)


AI Ready

1) Optimize resource allocation for AI interference at the edge via Intel® Distribution of OpenVINO™ toolkit across CPU, GPU, and VPU
2) Optional VPU by adding UP AI Core XM2280/KB2280, speed up your AI development by leveraging samples and various pre-trained models that come with the kit
3) Supports Intel’s third-gen VPU (code-name: Keem Bay) that will offer 10 times the AI Performance than its Intel® Movidius™ Myriad X chip, but with up to 4.7 times more power efficiency


Production Ready Computing System

1) UP Xtreme i11 Edge Compute Enabling Kit is production-ready for multiple vertical markets for robotics, automation, retail, AI and IoT. Worldwide shipping in 7 days.
2) The kit comes with Intel® Distribution of OpenVINO™ Toolkit pre-loaded to make your AI and computer vision application faster. It is also compatible with Intel® OneAPI, which is easy to install via command line.

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