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UP Xtreme i11 Edge Compute Enabling Kit

 Note 
Available in 2021 Q1



UP Xtreme i11 Edge Compute Enabling Kit comes with 5G to enable ultra-low latency and reliable transmission of data to/from masses of IoT devices, which ensures the convergence of 5G, AI, Cloud Computing, Data Analytics, and IIOT.

Combined with Intel AI Accelerator and Intel® Distribution of OpenVINO™ toolkit, it accelerates Computer Vision (CV) and Deep Learning Inference from Edge to Cloud. It also offers pre-trained models, and pre-optimized kernels to increase performance for AI.

Powerful: The latest 11th Gen Intel® Core™ processor with Intel Iris Xe graphic
Fast: NVMe, USB 3.2, USB 4.0 Type C
Expandable: 40-pin I/O expansion, M.2 2230 E key, M.2 2280 B+M key, M.2 3052 B Key, PCIe [x4] to allow for seamless integration.
Ready to connect: Ready to connect 5G, WiFi ( WiFi 5/WiFi 6), Bluetooth

*Specifications are preliminary and subject to change before mass production part number*
**Prices will be updated before final scheduling**

See datasheet for more specifications datasheet

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Datasheet

General
SKU UPX-XXX
Basic info
Part number UPX-XXX
Mainboard UP Xtreme
Availability/Type New Product
System level spec
SoC Intel® 11th Gen Core™ Processors
Graphics Intel® Iris® Xe Graphics
VPU optional (via M.2 2280)
FPGA Intel® FPGA Altera Max V
memory Up to 64GB DDR4
eMMC Depends on Storage Device
BIOS UEFI
RTC Yes
WAKE ON LAN (WoL) Yes
Watchdog timer Yes
PXE Yes
Compatible OS Microsoft Windows 10 full version, Yocto project 3.0/3.1 kernel 5.4, Ubuntu 20.04 kernel 5.8
Pre-installed OS Ubuntu 20.04 Kernel 5.8
Power requirement 12V DC-IN (lockable connector)
Power Supply Type AT (default) /ATX
Power Consumption ( typical) 32 Watt
Dimension 152 x 124 x 66.5 mm (5.98" x 4.88" x 2.61")
MTBF ( hours) T.B.A.
Display
HDMI 1 (HDMI 2.0)
Display Port 1x (DP 1.4)
1x DP via USB type C( USB 3.2 and DP dual function)
I/O
Audio Audio Out/Mic In, I2S
USB 3.2 (Type A) 4
USB 4.0 Type C 1
Serial port Fintech F81801, 2x RS232/422/485
HDD interface 1 x SATA 3.0
Expansion Slot 1x M.2 2280 M key ( support NVME SSD) ,1x M.2 2230 E key, 1x M.2 3052 B key
40-pin GP-Bus 1 via Phoenix 1
SIM slot Yes
Others Phoenix: 3V3, 5V, GND, I2C, GPIO x8, PWM x2
Connectivity
Ethernet 1x LAN (Intel® i225, 2.5 Gbps, supports Intel vPro® & TSN)
1x LAN (Intel® i219, 1 Gbps, supports Intel vPro®)
WiFi optional ( via. M.2 2230 )
Bluetooth optional ( via. M.2 2230 )
LTE/4G optional ( via. M.2 3052 )
Cooling
Cooling passive cooling (fanless)
Environment
Operation temperature 32°F ~ 140°F (0°C ~ 60°C)
Storage temperature -40°F ~ 176°F (-40°C ~ 80°C)
Operation Humidity 0% ~ 90% relative humidity, non-condensing
Certification CE/FCC Class A,RoHS
Longevity
Longevity 2035
Package
Net weight 2.3 kg
Package dimension (L x W x H) 585*565*175mm
Gross weight 3.6 kg
HS Code 8471500000
Country of Origin Taiwan

More Info

Powerful

1) The latest 11th Gen Intel® Core™ processor with Intel Iris Xe graphic (code name: Tiger Lake) powers the UP Xtreme i11 Edge Compute Enabling Kit and clocks up to 4.4 GHz with only 28 watts TDP and 15 watts cTDP.
2) Intel® Iris® Xe graphics provide up to 96EU, which is nearly twice the performance of corresponding Ice Lake Gen 11 at the same TDP.


Fast & Expandable

1) 5G supported for ultra-reliable low latency communications
2) Intel® Ethernet Controller i225 runs 2.5 Gbps Speed
3) Ready to connect: Ready to connect 5G, WiFi ( WiFi 5/WiFi 6), Bluetooth


Industrial and Security

1) Supports standard industry 12V power input with a lockable power connector
2) Reduce latency and minimize jitter with Intel® Time Coordinated Computing (TCC) and time-sensitive networking (TSN) technology
3) TPM 2.0 & In-Band ECC Supported
4) Supports Functional Safety (FuSA): First Intel® Core™ product combining Integrity Features and Intel® Functional Safety Essential Design Package (Intel® FSEDP)


AI Ready

1) Optimize resource allocation for AI interference at the edge via Intel® Distribution of OpenVINO™ toolkit across CPU, GPU, and VPU
2) Optional VPU by adding UP AI Core XM2280/KB2280, speed up your AI development by leveraging samples and various pre-trained models that come with the kit
3) Supports Intel’s third-gen VPU (code-name: Keem Bay) that will offer 10 times the AI Performance than its Intel® Movidius™ Myriad X chip, but with up to 4.7 times more power efficiency


Production Ready Computing System

1) UP Xtreme i11 Edge Compute Enabling Kit is production-ready for multiple vertical markets for robotics, automation, retail, AI and IoT. Worldwide shipping in 7 days.
2) The kit comes with Intel® Distribution of OpenVINO™ Toolkit pre-loaded to make your AI and computer vision application faster. It is also compatible with Intel® OneAPI, which is easy to install via command line.

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